=== From Idea to POC in 100 days === We take your Idea and 1. Do Architecture analysis and design. == Workflow == Our workflow is spread across the following milestones. ML1: Requirement Gathering and Project kickoff. This milestone involves a series of discussion via IM, Email, Voice calls etc. The purpose of this milestone is to share domain knowledge and product requirement. During this milestone we will iteratively build discuss and refine the following documents. 1. Product Requirements. ==== ML2 Component Sourcing ==== ==== ML3 Coding ==== This is the longest phase, in this phase we do the following, * Write firmware, device drivers, application software, and RTL code. The prototype board is delivered to the client for his testing and approval. ==== ML4 PCB Fabrication and assembly ==== The PCB design in ML3 is transferred to the selected PCB fabrication and assembly house. ==== ML5 Testing ==== The assembled PCB received from the fabricator is tested for all the requirements stated in the PRD. The tested PCB is delivered to the client for his testing and approval. ==== ML6 Project closure ==== The final design files are handed over to the client. == Budget == There are three set of costs involved. 1. Engineering cost. ==== Engineering cost ==== The engineering cost can be estimated as follows. $500 for ML1. The total cost for these can be calculated at an hourly rate of $30/hr or a weekly cost of $1000/wk ==== Material Cost ==== At end of ML1 we would have a 'bill of materials(BOM)' for all the parts required for the design and prototype, These parts will be ordered during ML2. ==== Fabrication cost ==== This is the amount charged by the fabricator for fabrication and assembly of the device. ==== Shipping cost ==== We ship the prototype and the final board to the client, this may involve a shipping cost.