Electronic Sensor Packaging Program · Initiated idea for the physical design Sensor for a sensor for an automotive application, using electronic materials, i.e., printed wiring / substrate technology · Supported program by design, development, and provision of prototype sensors that fit various auto designs using a variety of interconnect substrate technologies including: o Thick Film gold on alumina ceramic o Thin Film aluminum on alumina ceramic o Flexible Circuit (Copper on Kaptonr Polyimide) o Printed Wiring Board · Developed present sensor configuration consisting of Thick Film Gold and Thin Film Gold Metallized Ceramic · Developed Package for the sensor Metal Matrix Composite Electronic Package Materials · Al/SiC MMC microwave electronic package mechanical properties and stress verification developed, implemented with UCLA for for Lockheed-Martin, 1994 Microwave Electronic Package Metallurgical Microjoining · Evaluated Au/Sn and Au/Ge soldering and brazing process