Electronic Sensor Packaging Program
· Initiated idea for the physical design Sensor for a sensor for an automotive application, using electronic materials, i.e., printed wiring / substrate technology
· Supported program by design, development, and provision of prototype sensors that fit various auto designs using a variety of interconnect substrate technologies including:
o Thick Film gold on alumina ceramic
o Thin Film aluminum on alumina ceramic
o Flexible Circuit (Copper on Kaptonr Polyimide)
o Printed Wiring Board
· Developed present sensor configuration consisting of Thick Film Gold and Thin Film Gold Metallized Ceramic
· Developed Package for the sensor
Metal Matrix Composite Electronic Package Materials
· Al/SiC MMC microwave electronic package mechanical properties and stress verification developed, implemented with UCLA for for Lockheed-Martin, 1994
Microwave Electronic Package Metallurgical Microjoining
· Evaluated Au/Sn and Au/Ge soldering and brazing process