• Excellent experience in placement and routing of Analog, Digital, RF and mixed signal design. • Experienced in design of high density multilayer PCBs (up to 16layers) with impedance Matching in strip and micro strip lines. • Experienced in routing of DDR2, FPGA, DDR3, DDR4, QDR4, USB, Ethernet, Audio CODEC, and QSFP, PCIe, BPI Fash, HDMI interfaces. • Experienced in placement and routing of multi layer RF boards and micro strip method. • Experienced in Flex boards. • Hands on experience in creating Foot prints as per IPC Standards. • Hands on experience in schematic drawing in Orcad Design Capture and Concept HDL,Eagle design • Knowledge in DFM, DFA and DFT analysis